Mar 06, 2014
Shanghai - The first meeting of the NEPCON 2014 Advisory Panel was recently held at the offices of the exhibition organizers, Reed Exhibitions Shanghai.
Feb 18, 2014
JUKI announces the launch of the RV-1 PWB inspection machine, which significantly improves inspection accuracy and speed with both automatic optical inspection (AOI) and solder paste inspection (SPI) functions.
Jan 27, 2014
Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces the launch of its XM8000 Wafer X-ray Metrology Platform at the SEMI European 3D TSV Summit taking place in Grenoble, France 20-22 January 2014.
Jan 27, 2014
JUKI introduces its new solder paste printer RP-1 with improved accuracy and productivity of PWB solder printing, excellent for high-density packaging of downsizing electronic devices.
Jan 20, 2014
Juki recently launched the RX Series of high-speed compact modular mounters to improve productivity by 58 percent.
Oct 07, 2013
Juki's recently released LED Mounter JX-300LED now features an enlarged PCB size capacity and improved the placement speed.
Aug 15, 2013
Tresky's wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.
May 07, 2013
Ryder Industries is working with its UK strategic designer partner to release two new DSP modules for quick build-in design of pro audio devices.
Apr 10, 2013
The agreement with MIRTEC and Bosch was signed at the end of March. As part of the multi-million dollar agreement, Bosch gave MIRTEC an exclusive supplier contract for multiple MV-9 2D/3D AOI systems.
Mar 15, 2013
BPM Microsystems announces that it will exhibit its award-winning 2800ISP parallel in-system device programmer in Booth #2134 at the DESIGN West conference and exhibition, scheduled to take place April 22-25, 2013 at the McEnery Convention Center in San..