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Materials Analysis Technology Inc. Press releases

1 - 7 of 7 Press Releases

Jul 25, 2013
FIB Circuit Edit, Materials Analysis, Electrical Failure Analysis (EFA), Physical Failure Analysis (PFA), Surface Analysis, Packaging and Bonding, ESD and Latch-up (Static Latchup, Dynamic Latchup, Transient Latchup), TLP, and Reliability Testing.

Dec 17, 2012
Uniform and highly SERS active substrates composed of silver (Ag) nanoparticles arrays with sub-5 nm gap. Transparent substrates, for Raman imaging of bacteria, are also available. Our SERS substrates offer stable and highly reproducible signals.

Sep 11, 2012
High resolution (ppm to ppm level) depth profiling of dopants and impurities. Surface analysis of Integrated circuits, and opto-electronic devices. Useful depth resolution for elemental analysis about 1 nanometer. SA for Reverse Engineering.

Sep 01, 2012
Electrostatic Discharge (ESD) Testing: HBM, MM, & CDM (socket & non-socket). Latch-up Testing, and Transmission Line Pulse Testing. Triboelectric charge accumulation testing. Testing Standards: MIL-STD, JEDEC, ESDA, AEC and IEC.

Aug 16, 2012
MA-tek offers world class reliability testing services for determining life time, product yield, & performance of electronic devices. We can also offer chemical testing and physical-electrical reliability testing to determine genuine electronics.

Aug 11, 2012
IC Decapsulation, IC Circuit Repair , Non-destructive Analysis, Electrical Failure Analysis, and ESD Testing. Please read this promotion article for (1) detailed services, and (2) scientific-technical concepts.

Aug 07, 2012
Materials Analysis and Technology (MA-tek) Incorporation, is a Taiwan based World Class Lab for Material Analysis, Failure Analysis, Reliability Testing and Third Party Verification. International accreditation: ISO9001 and IECQ17025.


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