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Henniker Scientific Ltd. Press releases

1 - 10 of 25 Press Releases

Jul 13, 2015
Henniker Scientific Ltd. of Warrington, England are pleased to announce that the latest model of the MAX300 LG Quadrupole Gas Analyser is now available with an ultra-fast response sample introduction inlet for Transient Gas Analysis applications.

Jul 09, 2015
Henniker Plasma, a UK based supplier of plasma surface treatment equipment and processes, document the advantages of plasma treatment to improve adhesion on a wide range of engineering polymers.

Feb 16, 2015
Henniker Scientific are pleased to announce that the Veraspec range of Molecular Beam Gas Analysers has been extended to meet the specific demands of reaction monitoring in pyrolysis and gasification research applications.

Jun 27, 2014
Henniker announce the release of its new automated atmospheric plasma robot for surface activation of polymers to improve adhesion.

May 30, 2014
UVS 40 High Intensity Ultraviolet Source The UVS 40 is a high intensity Photon Source capable of operation with a range of discharge gases and suited to UPS measurements under ultra-high vacuum conditions.

May 30, 2014
The latest TMC13 Deposition Rate Controller from Henniker Scientific is further extended with 0.01Hz frequency resolution and support for multi-crystal sensors with each crystal being controlled individually.

May 10, 2013
The all new PGx from Henniker is a Portable Contact Angle measurement instrument designed for rapid and accurate assessment of plasma treated materials.

May 10, 2013
The all new Extrel MAXCS-50 Series quadrupole mass spectrometer from Henniker Scientific has been released and directly addresses research applications requiring high sensitivity gas analysis of low molecular weight species.

Apr 12, 2013
UK company Henniker announces a new 1,400 sqft dedicated plasma surface treatment and testing facility in Warrington, UK.

Apr 12, 2013
The all new TMC13 Deposition Rate Controller from Henniker Scientific is a versatile, multi-channel device for repeatable, reliable and accurate control of film thickness and rate in vacuum based thin film deposition processes.


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