Advanced Thermal Solutions, Inc. (ATS) Press releases61 - 70 of 123 Press Releases
May 18, 2011
A telecommunications OEM had problems with thermal adhesive tape reliably attaching heat sinks to hot DSP chips in their new ATCA board for a 4G wireless application. ATS’s superGRIP heat sink clip with maxiFLOW heat sink solved these problems
May 12, 2011
Engineers can now get faster, more detailed price quotes for heat sinks from Advanced Thermal Solutions, Inc. (ATS) by completing a simple online form that can be reached from every heat sink products page on the ATS website, Qats.com.
May 02, 2011
A BGA component on a crowded circuit board required a low-cost heat sink that would manage excess heat and function in a confined space without the benefit of cooling air from a fan. A heat sink solution was provided by ATS, Inc.
Apr 25, 2011
This ATS webinar explains temperature measurement in electronic systems. It reviews the essential instruments and the best locations for testing to be conducted. It explains how to analyze temperature data as part of a complete thermal analysis.
Apr 20, 2011
ATS is now providing heat sink design services to thermally manage 2nd generation Intel Core iProcessors with Sandy Bridge Microarchitecture being used in ATCA, blade servers and single board computers
Apr 15, 2011
Linear maxiFLOW™ heat sinks from ATS extend the life and brightness of LEDs by removing excess heat from the dies that power the popular lighting devices. Their linear design allows cooling of multiple LEDs in displays and architectural lighting.
Apr 06, 2011
An OEM of ATCA cabinets recently resolved the thermal issue of a BGA whose die temperature was exceeding the high end of its safe operating range. The thermal problem was eliminated by attaching economical straight fin heat sink
Mar 28, 2011
Advanced Thermal Solutions, ATS, now offers the iQ-200™ thermal analysis system, which precisely measures both air and solid temperatures, air velocity, and air pressure for comprehensive profiling of heat sinks, components, and PCBs.
Mar 23, 2011
Advanced Thermal Solutions, Inc., ATS, is now providing the complete editorial contents of its widely-read Qpedia Thermal eMagazine in three hardbound volumes comprising every technical article published between 2008 and 2010.
Mar 15, 2011
ATS’s QPedia is proud to be a Media Sponsor of Electronics Thermal Week, co-sponsored by MEPTEC and SEMI-THERM. Three thermal management meetings are co-located: The Heat is On, SEMI-THERM and the JEDEC JC15 Committee on Thermal Standards