Advanced Thermal Solutions, Inc. (ATS)

A telecommunications OEM had problems with thermal adhesive tape reliably attaching heat sinks to hot DSP chips in their new ATCA board for a 4G wireless application. ATS’s superGRIP heat sink clip with maxiFLOW heat sink solved these problems

Engineers can now get faster, more detailed price quotes for heat sinks from Advanced Thermal Solutions, Inc. (ATS) by completing a simple online form that can be reached from every heat sink products page on the ATS website, Qats.com.

A BGA component on a crowded circuit board required a low-cost heat sink that would manage excess heat and function in a confined space without the benefit of cooling air from a fan. A heat sink solution was provided by ATS, Inc.

This ATS webinar explains temperature measurement in electronic systems. It reviews the essential instruments and the best locations for testing to be conducted. It explains how to analyze temperature data as part of a complete thermal analysis.

ATS is now providing heat sink design services to thermally manage 2nd generation Intel Core iProcessors with Sandy Bridge Microarchitecture being used in ATCA, blade servers and single board computers

Linear maxiFLOW™ heat sinks from ATS extend the life and brightness of LEDs by removing excess heat from the dies that power the popular lighting devices. Their linear design allows cooling of multiple LEDs in displays and architectural lighting.

An OEM of ATCA cabinets recently resolved the thermal issue of a BGA whose die temperature was exceeding the high end of its safe operating range. The thermal problem was eliminated by attaching economical straight fin heat sink

Advanced Thermal Solutions, ATS, now offers the iQ-200™ thermal analysis system, which precisely measures both air and solid temperatures, air velocity, and air pressure for comprehensive profiling of heat sinks, components, and PCBs.

Advanced Thermal Solutions, Inc., ATS, is now providing the complete editorial contents of its widely-read Qpedia Thermal eMagazine in three hardbound volumes comprising every technical article published between 2008 and 2010.

ATS’s QPedia is proud to be a Media Sponsor of Electronics Thermal Week, co-sponsored by MEPTEC and SEMI-THERM. Three thermal management meetings are co-located: The Heat is On, SEMI-THERM and the JEDEC JC15 Committee on Thermal Standards