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Advanced Thermal Solutions, Inc. (ATS) Press releases

81 - 90 of 138 Press Releases

Apr 15, 2011
Linear maxiFLOW™ heat sinks from ATS extend the life and brightness of LEDs by removing excess heat from the dies that power the popular lighting devices. Their linear design allows cooling of multiple LEDs in displays and architectural lighting.

Apr 06, 2011
An OEM of ATCA cabinets recently resolved the thermal issue of a BGA whose die temperature was exceeding the high end of its safe operating range. The thermal problem was eliminated by attaching economical straight fin heat sink

Mar 28, 2011
Advanced Thermal Solutions, ATS, now offers the iQ-200™ thermal analysis system, which precisely measures both air and solid temperatures, air velocity, and air pressure for comprehensive profiling of heat sinks, components, and PCBs.

Mar 23, 2011
Advanced Thermal Solutions, Inc., ATS, is now providing the complete editorial contents of its widely-read Qpedia Thermal eMagazine in three hardbound volumes comprising every technical article published between 2008 and 2010.

Mar 15, 2011
ATS’s QPedia is proud to be a Media Sponsor of Electronics Thermal Week, co-sponsored by MEPTEC and SEMI-THERM. Three thermal management meetings are co-located: The Heat is On, SEMI-THERM and the JEDEC JC15 Committee on Thermal Standards

Mar 08, 2011
ATS, inc., is presenting a free webinar: Heat Sink Materials: Choices and Tradeoffs on March 24 at 2 pm EST. The guest speaker is noted materials authority, Dr. Carl Zweben, Ph. D.

Mar 03, 2011
ATS’s on-line store, eSHOP, now features straight fin heat sinks coupled with the patented superGRIP™ heat sink clip. The pairing removes any need to drill holes in a circuit board and passes telecomm shock and vibration specifications

Feb 21, 2011
The thermal management experts at ATS, know that choosing the right heat sink the first time is essential. They will share their proven methods for choosing heat sinks at a free webinar presented live at 2PM EST on February 24.

Feb 16, 2011
Advanced Thermal Solutions HFC-100 simulates semiconductors capable of dissipating 1kW of heat over 1k /cm2. The HFC-100 replaces the need for costly silicon samples early in the physical design process, saving engineers thousands of dollars

Feb 09, 2011
ATS on-line ordering portal, eSHOP, now features standard pin fin heat sink extrusions giving customer’s a good performing, value priced cooling solution.


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