AAEON Technology

The UP TWL, UP Squared Pro TWL, and UP Xtreme ARL AI Dev Kits pair multi-tiered Intel processing with both software suite and hardware bundles.

A multi-pillar die processing architecture, 50% larger memory capacity, and out-of-band management support make the MIX-MTLD1 a cross-market AI standout.

AAEON's BOXER-8741AI will harness up to 2070 TFLOPS of AI compute performance for next generation robotics applications.

Pairing the OMNI-ADP Series with IntervalZero's KINGSTAR EtherCAT master stack, AAEON aims to reduce hardware costs and simplify industrial automation applications.

The UP Xtreme ARL harnesses the integrated features of the new Intel Core Ultra 200H Series alongside an industrial-grade I/O and rugged design features.

The uCOM-M700 and uCOM-M510 combine the MediaTek Genio platform with flexible multimedia capabilities to provide industrial-grade SMARC modules.

Comprised of server-side management tools, secure tunnel communication, and device-level security mechanisms, AAEON's new security package aims to protect AI models on the edge.

Following another year of excellent feedback, two lucky AAEON customers win grand prize.

Make sure to visit AAEON at Booth #1931 for live demos, new products, and more.

Make sure to visit AAEON at Booth #G3, #G17 for live demos, new products, and more.