ASTRI

Formal approval has recently been granted to ASTRI by China's Ministry of Science and Technology to establish the Hong Kong Branch of the National ASIC System Engineering Research Centre in collaboration with Southeast University in Nanjing.

ASTRI & Imperial College London jointly develop a new ultra low power Body Sensor Network sensing platform for healthcare and sport training applications. It is also suitable for applications in wearable healthcare and implantable medical devices.

Production-Ready Platform Built on Four Years of Pioneering Small Cell Collaboration

MiniLogic Device Corporation Limited, a long-time industry partner of Hong Kong Applied Science and Technology Research Institute (ASTRI), was successfully listed on the Growth Enterprise Market of The Stock Exchange of Hong Kong Limited last month.

IEEE held its board meeting in HK for the first time last week. Arranged by ASTRI, the IEEE directors visited Shenzhen Municipal People’s Government and met with Shenzhen Mayor Dr Xu Qin. They also visited corporations in both HK & Shenzhen.

Two distinguished researchers from Hong Kong Applied Science and Technology Research Institute (ASTRI), Dr Wang Keh-chung and Dr Wu Enboa were conferred the title of Fellow by IEEE.

In the forthcoming World University Games 2011, Shenzhen ACTO Digital Video Technology Co. Ltd will provide more than 1,000 pieces of portable smart pico-projector developed with ASTRI's technologies for on-site reporters' free use during the event.

ASTRI and HKUST will co-organize the first IEEE Technology Time Machine (TTM) Symposium in Hong Kong in June. Themed “Technologies beyond 2020”, the Symposium will cover a selected set of potentially high impact emerging technologies.

The first pilot project will focus on developing a healthcare tablet and telehealth application to increase the efficiency and effectiveness of care at home and hospital.

ASTRI and Velosti Technology Limited have recently signed a two-year agreement under the institute’s Industry Collaborative Project scheme to co-develop a USB 3.0 chip to tap into the rapidly expanding market.