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SparkLAN Communications, Inc Press releases

21 - 30 of 64 Press Releases

May 19, 2017
SparkLAN Communications, Inc., an embedded wireless M2M (machine to machine) networking solution provider, introduces Industry Leading Dual-Band Half Mini PCIe Module for wireless connectivity applications.

May 12, 2017
WLRS-590 is the first sub-1GHz SparkLAN wireless module, which is designed & manufactured in a smallest form factor -SiP (System in Package) that is a general purpose SiP for sensor integration.

May 11, 2017
SparkLAN Communications, Inc., a broadband wireless networking solution provider ships the wireless 802.11ac/a/b/g/n Dual-Band (2.4GHz / 5GHz) M.2 Card that combines Bluetooth , adopt LGA (Land grid array) packaging technology.

May 09, 2017
11ac Wireless USB Module Enables Wi-Fi Connection for High Throughput Networking and Multimedia Applications

Dec 06, 2016
802.11ac/a/b/g/n Dual Band 2T2R WiFi+ BT 4.1 Combo M.2 2230 Module

Nov 20, 2016
802.11b/g/n Industrial-Grade -40~+85°C IOT Module, Qualcomm Atheros QCA4010 , 1T1R

Nov 17, 2016
802.11ac/abgn Dual-Band 2T2R QCA9892 Military Temp -40~+85°C Mini PCIe Module

Nov 17, 2016
802.11ac/b/g/n Dual-Band Industrial Temperature -40~+85°C Embedded WiFi Mini PCIe Module, Qualcomm Atheros QCA9890-BR4B 3T3R

Nov 17, 2016
802.11ac/b/g/n Dual-Band Military Temp Mini PCIe Module, Qualcomm Atheros QCA9890-BR4B 3T3R

Oct 12, 2016
802.11ac/b/g/n Dual-Band Mini PCIe Module, Qualcomm Atheros QCA9882-BR4A 2T2R

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