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AI Technology, Inc. Press releases

1 - 4 of 4 Press Releases

Sep 14, 2019
• First UV Releasing Wafer Processing Adhesive Capability for Wafer Processing Up to 270ºC • First Peel Release Format Wafer Processing Adhesive to Provide Processing Up to 330ºC • First Rinse-Free and Residual Free Wafer Processing Adhesive in...

Sep 10, 2019
 Transparent Protective Coating on Decorative Metals, Plastics, Marbles and Granite Surfaces  Protection Coating over Traditional Protective Coating to Extend the Protection to 15-30 Years  Protection Coating over Ceramics High Voltage...

Aug 28, 2019
World thinnest c-DAF at 10 micron thickness with outstanding melt-flow for ease of wafer lamination. Proven UV and peel release dicing tape compatibility for easy roll lamination onto wafer with dicing tape before dicing and singulation.

Aug 26, 2019
Proven salt fog-spray and acid rain moisture resistant conformal coating engineered for effective coverage and more more protection for sensitive components and printed wiring board with 1/3 coating thickness


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