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AI Technology, Inc. Press releases

1 - 5 of 5 Press Releases

Hyper-conductive Coating for Component Level EMI/RFI Shielding
Sep 26, 2019
 Hyper-conductive Conductive Coating for Package Level EMI Shielding  90dB+ EMI Shielding Effectiveness from MHz to Millimeter GHz at

No Rinse Wafer Processing Adhesive (WPA) For Up To 330ºc With 0% Residual
Sep 14, 2019
• First UV Releasing Wafer Processing Adhesive Capability for Wafer Processing Up to 270ºC • First Peel Release Format Wafer Processing Adhesive to Provide Processing Up to 330ºC • First Rinse-Free and Residual Free Wafer Processing Adhesive in...

Protective Coating for UV, Moisture, Acid Rain, Salt Spray and Extreme Weather Cycling
Sep 10, 2019
 Transparent Protective Coating on Decorative Metals, Plastics, Marbles and Granite Surfaces  Protection Coating over Traditional Protective Coating to Extend the Protection to 15-30 Years  Protection Coating over Ceramics High Voltage...

AIT Introduces World Thinnest (10-micron) Conductive Die-Attach Film (c-DAF) for Wafer Level High Power Die-Attach Application
Aug 28, 2019
World thinnest c-DAF at 10 micron thickness with outstanding melt-flow for ease of wafer lamination. Proven UV and peel release dicing tape compatibility for easy roll lamination onto wafer with dicing tape before dicing and singulation.

AIT Announces Parylene Grade Conformal Coating that Exceeds the Requirements of Radio Technical Commission for Aeronautics (RTCA DO 160)
Aug 26, 2019
Proven salt fog-spray and acid rain moisture resistant conformal coating engineered for effective coverage and more more protection for sensitive components and printed wiring board with 1/3 coating thickness


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