FIBERSTAMP TECHNOLOGY CO.,LTD

FIBERSTAMP, a global provider of open optical networking solutions, will present its latest 48G SDI optical interconnect solution and O-Band 12G SDI DWDM transmission solution at NAB Show 2026, addressing the increasing demand for high-quality,...

Live demonstrations highlight next-gen optical interconnects for AI, hyperscale, and data center networks.

HYBRID 800G ACC+, 800G AOC, and 1.6T Silicon Photonics AOCs Recognized

FIBERSTAMP announced that it will exhibit at DesignCon 2026, where it will demonstrate its next-generation 800G HYBRID ACC+ Active Copper Cable and an 800G silicon photonics module based on the HYBRID architecture.

Balancing power efficiency, signal integrity, and scalability for next-generation 800G and 1.6T interconnects

As AI workloads expand and data center demands intensify, the architecture of optical interconnect systems is evolving. Traditional pluggable optics face challenges in power, bandwidth density, and system efficiency.

Next-Generation Optical Interconnects for AI and HPC Systems

FIBERSTAMP has announced the launch of its 400G QSFP-DD ER4-30km optical module, built on narrow-grid LAN-WDM wavelengths.

FIBERSTAMP, a provider of cost-optimized DWDM optical communication solutions, today announced its participation in Network X 2025, the world's leading telecom and digital ecosystem exhibition, to be held October 14–16 at Paris Expo Porte de...

As AI supercomputing, HPC, and next-gen data centers evolve, high-speed connectivity isn't enough—efficient thermal management is now critical.