Indium Corporation

Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.

Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.

Since October, Pathways in Technology Early College High School (P-TECH) Oneida-Herkimer-Madison (OHM) BOCES students have analyzed, brainstormed, and designed a real-world product packaging solution for Indium Corporation, Utica’s Technology...

Indium Corporation's EZ-Pour® Gallium Trichloride (GaCl3) simplifies the use of gallium trichloride by allowing the user to easily transfer the product from one container to another at room temperature.

Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany.

Indium Corporation announces the addition of Donna Vareha-Walsh as Director, Metals Unit.

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.

Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.

Indium Corporation announces the release of its newest informational video detailing the benefits of using low-temperature solder alloy systems based on indium and bismuth.

Indium Corporation announces the release of its newest informational video that guides the audience on the proper steps for selecting a solder preform.