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Senseeker Engineering Press releases

1 - 9 of 9 Press Releases

Senseeker Expands Low-Noise Neon® Digital Readout IC Family for SWIR Applications
Jul 16, 2024
The 10 µm, 1280 x 1024 Neon® RD0131 DROIC is available now for commercial use

Senseeker Offers Low-Noise Neon™ Digital Readout IC for SWIR Applications
Jul 06, 2023
The 10 µm, 640 x 512 Neon™ RD0033 DROIC is available now for commercial use

Senseeker Launches High Dynamic Range Calcium™ Digital Pixel Readout IC
Oct 06, 2022
The 20 µm, 640 x 512 Calcium™ RP0033 DPROIC is available now for commercial use

Senseeker Introduces Oxygen® Cryogenic Evaluation Kit
Oct 05, 2021
Holistic front-end infrared imaging solution enables FPA developers to reduce development cycle time

Senseeker Engineering Acquires SE-IR Corporation
Mar 02, 2021
Senseeker's Ability to Enable FPA Developers is Strengthened by Purchase of Leading Test Dewar and Electronics Company

Senseeker Introduces Sales of Oxygen® RD0092 DROIC Quarter Wafers
Aug 27, 2020
Making Digital Readout ICs an Affordable Alternative to Legacy Analog Products

Senseeker Establishes In-House Wafer Testing Capability
Jul 02, 2020
New equipment installation for quick-turn testing and enhanced customer service

Senseeker Announces Availability of State-of-the-Art Digital Pixel Readout IC
Mar 16, 2020
The Magnesium™ MIL RP0092 DPROIC is available now for U.S. Government approved use

Senseeker Announces the World's First 8 µm Pitch, Dual-Band Infrared Imaging DROIC
Feb 10, 2020
The Oxygen™ RD0092 is available off-the-shelf and is shipping now


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