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Second, the thickness of the second inequality is a natural phenomenon of copper, because copper during the second exposure to the copper surface itself is uneven, so the local current density is also very different

In electroless copper steps, we will focus on the reduction and copper processes. According to replace the bath before the treatment effect, to the oil and activation are good, coarsening is not much relation with this phenomenon

Organic solderability preservative coating OSP Application Process With the light of electronic products, thin, short, small, multi-functional direction, toward the high-precision printed circuit boards

As we all know, Hole plywood production process is the most critical aspect of the intrinsic quality of her relationship to the multilayer good or bad. Hole drilling process is divided into to two copper pollution

This phenomenon was called the fish-eye phenomenon, this phenomenon is and electroplating liquid gloss agent relationship between the chlorine content, if the residue is purely Watermark

Printed circuit board plating bath control solution System circuit board plating bath solution, the main purpose is to keep control of all the chemical composition

Electroplating copper chloride causes of excessive consumption This article discusses the printed circuit board copper sulfate in an "excessive consumption of chloride ions" phenomenon, analyzing the problem.

PCB Copper Plating Copper Plating Analysis of the pinhole This article discusses the process of copper plating copper PCB appears pinhole, and suggests ways to find the pinhole copper plating, for reference.

This paper describes the application of Neopact direct plating process, including process and control parameters on the solution performance, quality testing, waste water treatment. The process is reliable

How to Choose a Reliable Multilayer PCB Fabrication Company from RayMing PCB